Call for Papers
IMAPS Nordic, in collaboration with IEEE EPS and IMAPS Europe, hereby invite you to submit an abstract to the 23rd European Microelectronics and Packaging Conference and Exhibition (EMPC2021).
EMPC2021 will take place in the beautiful city of Gothenburg, Sweden on the 13th to 16th of September 2021. The event will present the best of microelectronics packaging and interconnection technologies, providing world-class coverage of technological innovation in the microelectronics and packaging field with contributions from both industry and academia.
Topics
You are welcome to submit abstract(s) presenting new developments and knowledge in areas such as:
Advanced Packaging
- 3D integration, System-in Packages, FI- and FO-WLP, innovative interconnects, circuit solutions, Panel level packaging, Substrate and Interposer Technologies, emerging Heterogenous Integration Technologies
Advanced packaging for MEMS & sensors
- Sensors, actuators and RF systems
Electronics Reliability & Quality
- Methodology, Predictive maintenance, Novel reliability test methods., Modelling, Statistical reliability analysis and life models, Failure analysis and material characterization
Green Technologies
- Recycling, supply chain, low power computing
Harsh environment applications
Aerospace, automotive, rail, washable wearables, smart farming, drilling, HTHP (high temperature and high pressure) O&G wells, geothermal energy and process industry
Materials & Processes
- Manufacturing and assembly technologies, new materials, compatibility, enabling materials, nano-materials and processes
Medical electronics
- Implantable devices, miniaturization, neural interfaces, validation, new trends, reliability of implanted electronics, sensors for (implantable) medical devices
Opto-electronics
- Packaging, light sources, detectors, photonic integrated circuits based on III-V/Si technology platforms, emerging materials, applications
Power electronics
- Packaging, Thermal management, Wide Bandgap applications, Energy-conversion technologies,
Printed electronics
- Materials and processes, Flexible, Structural, Applications (automotive, energy, medical, wearable and others)
How to submit
We kindly ask you to start preparing your abstract. The abstract should be 300-500 words and may include images.
Create an account to submit.
If you have any questions regarding abstracts please contact: empc2021@meetx.se
Extended abstract deadline: Tuesday, February 9th, 2021.
Notification of acceptance: Tuesday, April 13th, 2021
Full manuscript submission: Tuesday, June 15th, 2021
We hope to see you in Gothenburg in September 2021!
IMAPS Europe’s Copyright for EMPC2021
This text contains excepts from the “IMAPS-Europe Exclusive Licence-to-Publish form” that must be signed by the author when the final paper is submitted to the conference.
IMAPS-Europe intends to publish papers presented at its events in the Proceedings of the Event and subsequently in technical journals and submit to IMAPSource and IEEE Xplore databases. For these purposes, IMAPS-Europe requires from authors of all papers the Exclusive Licence to publish each paper you have submitted into these publications and databases.
The Exclusive Licence to publish grants to IMAPS-Europe, the exclusive right of first publication of your article(s) for distribution throughout the world in printed, electronic or any other medium. You understand that first publication means that the Work will be published consecutively in the Event Proceedings and in the Databases. The EMPC-2021 Proceedings may also be held by the British Library’s Online Deposit to preserve a perpetual deposit.
Copyright in the Work remains yours
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