TOPICS

Advanced Packaging

  • 3D integration, System-in Packages, FI- and FO-WLP, innovative interconnects, circuit solutions, Panel level packaging, Substrate and Interposer Technologies, emerging Heterogenous Integration Technologies

Advanced packaging for MEMS & sensors

  • Sensors, actuators and RF systems

Electronics Reliability & Quality

  • Methodology, Predictive maintenance, Novel reliability test methods., Modelling, Statistical reliability analysis and life models, Failure analysis and material characterization

Green Technologies

  • Recycling, supply chain, low power computing

Harsh environment applications

Aerospace, automotive, rail, washable wearables, smart farming, drilling, HTHP (high temperature and high pressure) O&G wells, geothermal energy and process industry

Materials & Processes

  • Manufacturing and assembly technologies, new materials, compatibility, enabling materials, nano-materials and processes

Medical electronics

  • Implantable devices, miniaturization, neural interfaces, validation, new trends, reliability of implanted electronics, sensors for (implantable) medical devices

Opto-electronics

  • Packaging, light sources, detectors, photonic integrated circuits based on III-V/Si technology platforms, emerging materials, applications

Power electronics

  • Packaging, Thermal management, Wide Bandgap applications, Energy-conversion technologies,

Printed electronics

  • Materials and processes, Flexible, Structural, Applications (automotive, energy, medical, wearable and others)
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