Program overview
All times are given in Central European Time (CET)
Program overview
TOPICS
Advanced Packaging
- 3D integration, System-in Packages, FI- and FO-WLP, innovative interconnects, circuit solutions, Panel level packaging, Substrate and Interposer Technologies, emerging Heterogenous Integration Technologies
Advanced packaging for MEMS & sensors
- Sensors, actuators and RF systems
Electronics Reliability & Quality
- Methodology, Predictive maintenance, Novel reliability test methods., Modelling, Statistical reliability analysis and life models, Failure analysis and material characterization
Green Technologies
- Recycling, supply chain, low power computing
Harsh environment applications
Aerospace, automotive, rail, washable wearables, smart farming, drilling, HTHP (high temperature and high pressure) O&G wells, geothermal energy and process industry
Materials & Processes
- Manufacturing and assembly technologies, new materials, compatibility, enabling materials, nano-materials and processes
Medical electronics
- Implantable devices, miniaturization, neural interfaces, validation, new trends, reliability of implanted electronics, sensors for (implantable) medical devices
Opto-electronics
- Packaging, light sources, detectors, photonic integrated circuits based on III-V/Si technology platforms, emerging materials, applications
Power electronics
- Packaging, Thermal management, Wide Bandgap applications, Energy-conversion technologies,
Printed electronics
- Materials and processes, Flexible, Structural, Applications (automotive, energy, medical, wearable and others)
SECRETARIAT
Sweden Meetx AB is the conference bureau handling the conference secretariat for the EMPC 2021 Conference ®.
E-mail: empc2021@meetx.se
Tel: +46 31 708 86 90
