Short courses

EMPC 2021

Everyone who registers for the conference can at the same time also register for the Short Courses.
The price is SEK 750 per course (+25% VAT) and pre registration is mandatory.

All times are given in Central European Time (CET) 

13th of September 2021, 08:00-11:00

MEMS Sensors and Actuators

Prof. Gabor Harsanyi
Budapest University of Technology and Economics, Department of Electronics Technology, Budapest, Hungary

This course will outline the basic technologies, structures and operation principles of various sensor and actuator (optoelectronic and passive) components applying MEMS (micro-electro-mechanical system) approaches. The device technologies gradually shifted from the hybrid integration applying beside semiconductors also ceramics, polymers, thick and thin films to single chip or stacked multichip MEMS structures that have small sizes, smaller consumption and can be integrated with smart functions. The large production scale and low cost of semiconductor based MEMS devices resulted in their widespread application not only in special fields like automotive and aerospace, but also in biomedical and consumer areas. The course will highlight the basic technology approaches, the possible mechanical elements that can be integrated with electrical circuit functions, gives a survey of examples from the practically realized structures, and their application possibilities are also discussed.


  1. Basic MEMS Technology Approaches: bulk micromachining and surface micromachining
  2. 3D MEMS Structures: trenches, membranes, bridges, cantilevers
  3. MEMS Sensor Examples: mechanical sensors, thermal sensors, chemical sensors, bosensors
  4. MEMS Actuator Examples: electrostatically land piezoelectrically driven types
  5. Application Examples: biomedical, automotive, consumer

Target audience

The course is designed for application designers and developers, MEMS developers as well as system development and manufacturing engineers to understand the operation principles and development trends of MEMS devices and to understand the direction for future requirements. Also newcomers are welcome since the course uses a description that can be understood easily.


Prof Gabor Harsanyi

Prof Gabor Harsanyi graduated in electrical engineering from the Budapest University of Technology and Economics in 1981 and received doctorate (dr. univ) in Electronics Technology from the same university in 1984. Thereafter, he moved to the Microelectronics Company (MEV, Hungary) where he developed his expertise in hybrid integrated circuits and sensors. In 1992, he received his Ph.D. from the Hungarian Academy of Sciences.

Since 1984, he has been a member of the research and teaching staff of the Department of Electronics Technology, Budapest University of Technology and Economics in various positions, and became the head of department in 2003. His main research topics are: reliability physics of high density electronic interconnection systems, sensors in biomedical applications. Hi published two books: “Polymer Films in Sensor Applications”, and “Sensors in Biomedical Applications”, which became part of the basic literature in sensors. Dr Harsanyi conducted a large number of scientific and industrial research and development projects, published more than 250 papers and has more than 1500 citations. He was a regular tutor of short courses organized by IMAPS, IEEE and Europractice. He was also member of the Technical Program Committee of IMAPS-Europe for several years and receiver the IMAPS Fellowship Award in 1998.

13th of September 2021, 11:30 – 14:30

Implications of New Semiconductor-Trends for IC-Packages

by Tanja Braun and Michael Töpper

Future electronic systems like autonomous systems using high-performance computing (HPC) and edge computing systems, sensor-integrated systems and bio-integrated devices will require more and more functions that cannot be managed by a single chip, even if advanced system on chip (SoC) concepts are used. In addition, a paradigm shift is taking place in many applications, in that data is progressively processed at a more localized level – from the cloud to the edge and down to the sensor node, thereby enabling meaningful information to be extracted, transmitted, stored or acted upon faster. 3D-stacking is also needed to realize smart sensor systems that aggregate a large amount of data and therefore have to be placed in close vicinity to the data processing, the data storage components and the transmission elements. Also, the increasingly higher costs for further node miniaturization in the IC manufacturing process will also promote the interconnection of chiplets. This means that intellectual property (IP) blocks made in different technology nodes will be combined on an interposer to reduce cost by increasing the production yield (smaller chips) and reuse across applications. In addition to the aforementioned approaches, optical intra-chip and intra-board communication need to be created in order to dramatically speed up communication and to significantly lower energy consumption

Therefore heterogeneous integration will appear at the chip package and organic substrate or panel level which will be discussed in this PDC.


  1. Introduction to new IC trends
  2. Implications for Wafer Level Packaging
  3. Implications for Panel Level Packaging
  4. Summary

Target audience

R&D Engineers and Decision Makers of the Semiconductor Industry for Advanced Packages


Dr. Tanja Braun

Tanja Braun studied mechanical engineering at the Technical University of Berlin with a focus on polymers and microsystems and joined Fraunhofer IZM in 1999. In 2013 she received her Dr. degree from the Technical University of Berlin for the work focusing on humidity diffusion through particle-filled epoxy resins. Tanja Braun is head of the group Assembly & Encapsulation Technologies. Recent research is focused on the fan-out wafer and panel-level packaging technologies and Tanja Braun is leading the Fan-out Panel Level Packaging Consortium at Fraunhofer IZM Berlin

Results of her research concerning packaging for advanced packages have been presented at multiple international conferences. Tanja Braun holds also several patents in the field of advanced packaging.

Tanja Braun is an active member of IEEE. She is member of the IEEE EPS Board of Governor (BOG) and serves as Region 8 Program Direc-tor as well as the IEEE EPS Women in Engineering (WIE) delegate.

empc 2021

Dr. Michael Töpper

Michael Töpper has a M.S. degree in Chemistry and a PhD in Material Science. Since 1994 he is with the Packaging Research Team at TU Berlin and Fraunhofer IZM. In 1997 he became head of a research group. In 2006 he was also a Research Associate Professor of Electrical and Computer Engineering at the University of Utah, Salt Lake City.

The focus of his work was Wafer Level Packaging applications with a focus on materials. Since 2015 he is part of the business development team at Fraunhofer IZM. Michael Töpper is a Senior Member of IEEE-EPS and has received the European Semi-Award in 2007 for WLP. He has published several book chapters and is author and co-author of over 250 publications.

13th of September 2021, 15:00 – 18:00

Achieving High Reliability of Lead-Free Solder Joints – Materials Considerations

Ning-Cheng Lee
Vice President of Technology of Indium Corporation, USA

This course covers the detailed material considerations required for achieving high reliability for lead-free solder joints. The reliability discussed includes joint mechanical properties, development of type and extent of intermetallic compounds (IMC) under a variety of material combinations and aging conditions, and how those IMCs affect the reliability. The failure modes, thermal cycling reliability, and fragility of solder joints as a function of material combination, thermal history, and stress history will be addressed in details. The selection of novel alloys with reduced fragility will be presented. Crucial parameters for high reliability solder alloy for automotive industry will be presented. Electromigration, and tin whisker growth will also be discussed. The emphasis of this course is placed on the understanding of how the various factors contribute to the failure modes, and how the selection of proper solder alloys and surface finishes for achieving high reliability are key.


  1. Main stream lead-free soldering practices
  2. Surface finishes issues
  3. Mechanical properties
  4. Intermetallic compounds
  5. Failure modes
  6. Reliability – Thermal cycle
  7. Reliability – Fragility
  8. Reliability – Rigidity and ductility
  9. Reliability – Composite Solder Enable Hierarchy Assembly & Shock Resistance
  10. Reliability – Tin whisker

Target audience

Directors, managers, design engineers, process engineers, and reliability engineers who care about achieving high reliability lead-free solder joints and would like to know how to achieve it should take this course.


Ning-Cheng Lee

Ning-Cheng Lee is the Vice President of Technology of Indium Corporation. He has been with Indium since 1986. Prior to joining Indium, he was with Morton Chemical and SCM. He has more than 30 years of experience in the development of fluxes and solder materials for SMT industries. He received his PhD in polymer science from University of Akron in 1981, and BS in chemistry from National Taiwan University in 1973.

Ning-Cheng is the author of “Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP, and Flip Chip Technologies” by Newnes, and co-author of 5 other books. He received 1991 award from SMT Magazine and 1993 and 2001 awards for best proceedings papers of SMI or SMTA International Conferences, 2003 Lead Free Co-Operation Award from Soldertec, 2008 and 2014 awards from IPC for Honorable Mention Paper – USA Award of APEX conference, and 2010 Best Paper Award of SMTA China South Conference.  He was honored as 2002 Member of Distinction from SMTA, 2006 Exceptional Technical Achievement Award from CPMT, 2007 Distinguished Lecturer from CPMT, 2009 Distinguished Author from SMTA, 2010 Electronics Manufacturing Technology Award from CPMT, 2015 Founder’s Award from SMTA, and 2017 IEEE Fellow.

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